ECICE2026

8th Eurasia Conference on IoT, Communication and Engineering

Topics on IoT, communication and smart manufacturing at National Formosa University in Yunlin, Taiwan. Present in person or online.

Submit a paper How submission works

Dates
13–15 November 2026
Venue
National Formosa University
Huwei, Yunlin, Taiwan
Format
Hybrid — in person or online
Abstract due
15 September 2026
Language
English
  • National Formosa University
  • Smart Machinery and Intelligent Manufacturing Research Center
  • IEEE Tainan Section Sensors Council

About the conference

8th Eurasia Conference on IoT, Communication and Engineering 2026 (ECICE 2026) will be held in National Formosa University, Yunlin, Taiwan on 13-15 November 2026, and it will provide a unified communication platform for researchers with IoT and Advanced Manufacturing topics. The booming economic development in Asia, particularly the leading manufacturing industries from auto-mobile, machinery, computer, communication, consumer product, flat panel display to semiconductor and micro/nano areas have attracted intense attention among universities, research institutions and many industrial corporations.

This conference aims to provide a broad international forum for world researchers, engineers, and professionals working in the areas of IOT and manufacturing to discuss and exchange various scientific, technical and management aspects across the wide spectrum of the society. The theme of the conference is set as smart manufacturing, focusing on new and emerging technologies. Papers with innovative idea or research results in all aspects of advanced manufacture are encouraged to submit. This conference is must attentive towards strong interactions among researchers disseminating their high-quality research results.

Meet the keynote speakers

Topics of interest

  • Internet & IoT technology
  • Communication science & engineering
  • Computer science & information technology
  • Computational science & engineering
  • Electrical & electronic engineering
  • Mechanical & automation engineering
  • Advanced machining and forming processes
  • Micro- and nano-fabrication
  • Surface manufacturing processes
  • Gears manufacturing
  • Bio-medical manufacturing
  • Precision engineering measurement
  • Robotics and automation
  • Additive manufacturing technology
  • Smart manufacturing technology for Industry 4.0
  • Environmental sustainability
  • Other related topics

Key dates

1 Jul 2026Abstract submission opens
15 Sep 2026Abstract submission due
30 Sep 2026Abstract acceptance notice
30 Sep 2026Full paper submission opens
20 Oct 2026Full paper due · early registration due
13–15 Nov 2026Conference

All dates, including post-conference

Publication

The conference full paper will be indexed by EI if the papers fit the scopes of IEEE (IEEE fields). Papers of other engineering fields will be sent to Engineering Proceedings (Journal Article, indexed by Scopus, Ranking: Q3, ISSN: 2673-4591) for reviewed and published. To maintain a high quality of conference proceedings, the English of full papers should be good enough. We will request authors to send the full papers for English editing if the papers do not pass the review process by the Program Committees.

Excellent papers selected from ECICE 2026 will be recommended to be published on suitable 20 different SSCI, SCI, ESCI, and Scopus journals after an additional review process and need extra publication charge.

See the journal list

Recommended journals

Excellent papers are recommended, after an additional review and with an extra publication charge, to one of these journals.

  1. Computer Modeling in Engineering & SciencesSCI, EI · JCR Q1 · IF 2.5
  2. Computers, Materials & ContinuaSCI, EI · JCR Q3 · IF 1.7
  3. Applied System InnovationESCI, EI · JCR Q2 · IF 3.8 · 20% APC discount
    • Artificial Intelligence
    • Human-Computer Interaction
    • Control and Systems Engineering
    • Information Systems
    • Medical Informatics and Healthcare Engineering
    • Industrial and Manufacturing Engineering
    • Applied Systems on Educational Innovations and Emerging Technologies
    • Applied Mathematics
  4. SensorsSCI · JCR Q2 · IF 3.4
  5. ElectronicsSCI · JCR Q2 · IF 2.6
  6. BioengineeringSCI · JCR Q2 · IF 3.8
  7. EnergiesSCI · JCR Q1 · IF 3.0
  8. HealthcareSCI, SSCI · JCR Q2 · IF 2.4
  9. Applied SciencesSCI · JCR Q1 · IF 2.5
  10. CoatingsSCI · JCR Q2 · IF 2.9
  11. Mathematics (special issue)SCI · JCR Q1 · IF 2.2
  12. Big Data and Cognitive ComputingESCI, EI · JCR Q1 · IF 3.7
  13. TechnologiesESCI · JCR Q1 · IF 4.2
  14. Journal of Sensor and Actuator NetworksESCI · JCR Q2 · IF 3.3
  15. ComputersESCI · JCR Q2 · IF 2.6
  16. TelecomESCI · JCR Q2 · IF 2.1
  17. DataESCI, EI · JCR Q2 · IF 2.2
  18. Sensors and MaterialsSCI · JCR Q4 · IF 1.2
  19. Journal of Low Power Electronics and ApplicationsESCI · IF 1.8
  20. Applied MechanicsESCI · IF 1.5

IIKII journals

Recommended papers are published in these journals with no publication charge.

Past proceedings